SunSource™ sputtering sources provide measurable benefits like improved target utilization, argon gas injection through the cathode body, stable operation through out the useful target lifetime during pulsed reactive sputter deposition at 10^-4 torr and much lower cost of ownership.  The features and benefits described for our standard line of SunSource™ and SunSource GEN II sources are incorporated into the retrofit/upgrade designs we provide.  Essentially, we take the basic sputtering module and configure it so that it fits within your existing system  Usually (not always) we can do so.

The ability to implement these features into a source that fits within the physical constraints of an existing system is how we define a retrofit sputtering source.  We are not interested in offering a source that performs and lasts just as poorly (but equally as well!) as the one it is replacing at a cheap price.  If you consume one target every 5 years, you will probably run from the room clutching at your throat about how expensive the source is, especially if your purchased your used system on e-Bay for $5.  Those interested in real productivity or trying to implement very difficult processes like an optical coating with less than 1% transmission adsorption will appreciate the performance of our upgrade retrofits and how reasonably they are priced for performance and reliability.  Good value for money provides a fast payback and low cost of ownership.

Maybe you just want to be able to "pour the coals" (aka shorten deposition time)  to a source to shorten run times without overheating the source, target material or damaging the substrate or the system the source is installed in.  Are you tired of constant leaks in the water lines, arcing and vastly different rates of target erosion top to bottom of a linear source or expensive repairs and spare parts?  We can help.

Materials Science, Inc originally began offering & advertising "retrofit" sputtering sources in early 1994.  Since then, this term has been adopted (co-opted?) by many of our competitors.  At the time, major manufacturers like MRC, Sloan, Perkin-Elmer & Vac-Tec Systems had either completely exited the marketplace as sputtering system suppliers or were about to and were simply not-available to support their customer base with new and upgraded sputtering sources that solved real problems.  Our main advantage at the time was greatly improved target utilization, but since then, we have continued to innovate and improve our SunSource™ sputtering sources.  The guy with a "cheater bar" in his pocket to give extra leverage to a wrench  to ensure all the fasteners are properly tightened and water lines don't leak is just as much in our mind as the scientist trying to figure out how many angels can dance on the head of a pin (has anyone finally figured this out?).  SunSource™ sputtering sources have to satisfy both of them.  Good design results from paying attention and being responsive.

Sales Brochure MC 900, Rev. B 01/18

This is a SunSource GEN II™ 5" x 15" source packaged to fit the MRC system, not just an exact
copy of the old design offered by most of our competitors.  It features:

• 40 wt% real target utilization
• Gas injection through the cathode body option
• Kamlok™ fast target exchange system - no fasteners to seize & gall
  or Insert-Style target clamping system eliminating screw seizures
  in the cathode body
• Low cost target backing plate for bonded targets instead of more expensive MRC cathode body
• Uses existing system anode shields
• Higher rates
• Lower pressures
• Magnet module for Ni (15-20 wt% utilization

  Interface Control Drawing 00000686 for Kamlok Style Version

  Interface Control Drawing 00002986 for Insert Style Version

Which "40%" target utilization source would you rather have?:

  Eroded target from leading competitors MRC Retrofit              Eroded targets from SunSource™ MRC Retrofit

90mm Wide MRC 600/900 Series Retrofit - For Precious Metals
 

90 x 381mm SunSource™ MRC Retrofit Eroded target from SunSource™ 90mm wide MRC Retrofit

This is a SunSource GEN II™ 90mm wide source packaged to fit the MRC system.  It features:   Much less expensive targets compared to standard MRC planar or inset targets Includes anode shields mounted on flange - replaces system anode shields 200mm (7.87") to 381mm (15") lengths 40 wt% real target utilization Gas injection through the cathode body option Kamlok™ fast target exchange system - no fasteners to seize & gall or Insert-Style target clamping system eliminating screw seizures in the cathode body Low cost target backing plate for bonded targets instead of more expensive MRC cathode body Higher rates Lower pressure Sales Brochure MC 900, Rev. B 01/18     90mm x 200mm Interface Control Drawing 00001084   90mm x 381mm Interface Control Drawing 00002341, Rev. C

• Improved target utilization by nearly 20 wt%
• Virtually eliminated re-deposition of backscattered
  material in center of target
• Bonded targets no longer have to be bonded to the
  cathode body - a much less expensive flat target
  backing plate is used instead
• Disassembly of cathode assembly is no longer
  required when exchanging targets

SunSource GEN II™ Upgrade Replacement:

• Fixed completely inadequate water flow through cathode body that overheated magnets and induced "wiggle" down length of source that created non-uniform films
• Much higher power levels can be applied and rates are higher
• Power distribution is now symmetrical and uniform across target surface
• Gas distribution is now uniform across target surface.  Solved argon gas depletion problem on target surface that caused significantly non-uniform distribution
• Electrons are not preferentially "robbed" from target surface toward ground planes, creating higher and lower areas of sputtering from target surface due to plasma disturbance, thus non-uniform films
• Targets thicker than 0.125" can now be sputtered.  Useful target life does not pre-dominate periodic maintenance requirement, as before.
• Effective target wt% target utilization is nominally 25% higher

• Improved target utilization by nearly 20 wt%
• Low pressure operation now possible - cleaner, denser films
• Virtually eliminated re-deposition of backscattered
  material in center of target
• Bonded targets no longer have to be bonded to the
  cathode body - a much less expensive flat target
  backing plate is used instead
• Gas distribution is now uniform across target surface
• Clamped & directly water-cooled targets now possible
• Disassembly of cathode assembly is no longer
  required when exchanging targets
• Sputters magnetic materials

  3.5" x 8" Interface Control Drawing 00000793, Rev. C

  3.5" x 12" Interface Control Drawing 00002106